THERMAL CONDUCTIVE PAD - It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide
FLEXIBLE STRUCTURE - The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity
USED IN VARIOUS SCENARIOS - It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces
GREAT RESULTS - By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components
8W/(m·K) THERMAL CONDUCTIVITY - With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements
